
Built on a branched-structure modification breakthrough from Chinese research teams, with a fully domestic petroleum-based route from the key upstream monomer (2,6-DIPN, 99% purity) through resin polycondensation — overcoming the low molecular weight that keeps conventional PEN from supporting biaxial orientation (BOPEN).
Chemistry-level innovation that removes the barriers to specialty polymers in high-voltage new-energy environments
Substantially raises the intrinsic viscosity (IV) of PEN resin, solving the industry bottleneck of insufficient melt strength that prevents conventional PEN from being biaxially oriented into film.
Glass transition (Tg) of 121°C and melting point (Tm) of 268°C, supporting 155°C–160°C continuous operation for F/H class thermal ratings.
Very high dielectric strength and corona-discharge resistance under high-frequency high voltage, with extremely low dissipation factor — an ideal match for 800V PWM environments.
Gas and moisture barrier 5 to 10 times that of standard PET; low moisture uptake keeps insulation performance intact in hot, humid, high-frequency conditions.
EnerPEN® compared side by side with standard BOPET and polyimide (PI)
| Performance dimension | Standard BOPET | EnerPEN® | Polyimide (PI) | EnerPEN® replacement value |
|---|---|---|---|---|
| Glass transition (Tg) | 78 °C | 121 °C | 280–360 °C | Over 55% above standard PET, meeting 800V automotive continuous heat needs |
| Melting point (Tm) | 255 °C | 268 °C | None (thermoset) | Excellent high-temperature dimensional stability and creep resistance |
| Continuous service window | 105 °C – 120 °C | 155 °C – 160 °C | 200 °C – 240 °C | Meets F/H class motor insulation, stable long-term at high temperature |
| Intrinsic viscosity & film process | Low (standard chips) | Markedly higher (branched) | Not applicable | Solves PEN's inability to support biaxial (BOPEN) film forming |
| Moisture & gas barrier | Baseline (1x) | 5x – 10x | 1.5x | Outstanding barrier against moisture ingress and electrolyte leakage |
| HF insulation & corona | Moderate | Very high / low loss | High | Strong partial-discharge and breakdown resistance under HV PWM pulses |
| Moisture uptake & wet insulation | 0.4% | Very low | 1.8%–3.0% | Avoids PI's water-driven insulation loss; stable resistance at high humidity |
Enabling the high-density electrical revolution across EVs, high-voltage drives, aerospace and energy storage
![[Application visual]: 800V stator slot liner, magnet-wire film wrap and oil-cooled winding separators](https://dszapsgvhthoyjysbizp.supabase.co/storage/v1/object/public/site-assets/scenarios/06fc5232-c2ef-4ae9-a40c-7d9f0a79131b.jpeg)
Where it is used: Stator slot liners, magnet-wire film wrap, separators in oil-cooled motor windings.
Customer pain point: 800V inverter voltage spikes trigger discharge; oil-cooled motors demand long-term hot ATF immersion resistance without powdering.
![[Application visual]: inverter DC-Link film capacitor with ultra-thin EnerPEN® dielectric metallization and winding](https://dszapsgvhthoyjysbizp.supabase.co/storage/v1/object/public/site-assets/scenarios/e87bdd13-7ef9-4011-a798-47bc913e23c1.jpeg)
Where it is used: EV main-inverter DC-Link capacitors, high-frequency switching power supply dielectric film.
Customer pain point: Conventional BOPP tops out at 105°C continuous; BOPET has higher dielectric loss with rising leakage current when hot.
![[Application visual]: lithium PACK interior highlighting high-temp PEN separator coating and inter-cell thermal barriers](https://dszapsgvhthoyjysbizp.supabase.co/storage/v1/object/public/site-assets/scenarios/2c94147c-779e-493d-93b6-f2c6c20b1411.jpeg)
Where it is used: High-temperature PEN separator coating, pack-level thermal-runaway barriers, CCS busbar insulation film.
Customer pain point: Aerogel insulation is costly; ordinary PET-coated separators melt and shrink during thermal runaway, causing wide-area shorts.
![[Application visual]: BMS flexible printed circuits and CCS busbars using EnerPEN® base film and stiffeners](https://dszapsgvhthoyjysbizp.supabase.co/storage/v1/object/public/site-assets/scenarios/073a2643-f9fc-40f6-8d1f-d43d7ea7f295.jpeg)
Where it is used: FPC stiffeners, flexible copper-clad laminate (FCCL) base film, CCS busbar insulation wrap.
Customer pain point: PI substrates are expensive and absorb moisture, driving high-frequency signal loss and delamination failures in humid air.
![[Application visual]: eVTOL battery bay with lightweight, high-strength EnerPEN® firewall wrap](https://dszapsgvhthoyjysbizp.supabase.co/storage/v1/object/public/site-assets/scenarios/7a5117ca-5432-4806-9425-863da23e7d32.jpeg)
Where it is used: eVTOL battery-bay firewalls, radome materials, lightweight outer insulation barriers for spacecraft.
Customer pain point: eVTOL platforms are weight-critical while demanding flame retardancy, -60°C–150°C shock resistance and radiation tolerance.
![[Application visual]: grid-scale container ESS with busbar insulation sleeving and inter-cluster barriers](https://dszapsgvhthoyjysbizp.supabase.co/storage/v1/object/public/site-assets/scenarios/ac3dc2bb-60a0-4bce-9fb5-811128fef847.jpeg)
Where it is used: Cell separators in grid-scale storage bays, HV busbar insulation sleeving, cabinet high-voltage layers.
Customer pain point: Storage assets must last 15–20 years; conventional plastics hydrolyse in hot humid service and break down, risking major fires.
A fully localized industrial route from naphthalene and propylene feedstock through 2,6-DIPN (99% purity), 2,6-NDA and 2,6-NDC to EnerPEN® chips and film.
Guangdong Enerzora Technology Co., Ltd. brings Chinese high-performance PEN material research to global EV Tier-1 suppliers, OEMs and commercial storage leaders. Contact us for partnerships and detailed specifications.